BGA Inspection System

Features :
•Accurate & Speedy Visual Inspection of •BGA Soldering and QFP Lead Sections •BGA ( Ball-Grid Array ) Inspection With this microscope, you can perform a visible check of the solder points and surface Thus, you can obtain highly reliable inspection and analysis results. •BGA Package Interior Inspection You can also inspect the interior section of the package by using the backlight system ( The backlight system is an option ) •QFP, Assembly Parts Inspection This microscope enables you to visually inspect the lead section of a QFP from the side You can also inspect other parts of a package freely as if using a pen.

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